The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Aug. 17, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Lin-Chen Lu, Kaohsiung, TW;

Tsung-Han Tsai, Miaoli, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/76814 (2013.01); H01L 21/76826 (2013.01); H01L 21/76828 (2013.01); H01L 23/5222 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 21/76832 (2013.01); H01L 2221/1063 (2013.01);
Abstract

A semiconductor device structure and methods of forming the same are described. In some embodiments, the structure includes a device and a first dielectric layer disposed over the device. An airgap is located in the first dielectric layer. The structure further includes a conductive feature disposed in the first dielectric layer, and the first dielectric layer includes a first portion disposed between the airgap and a first side of the conductive feature and a second portion disposed adjacent a second side of the conductive feature opposite the first side. The first portion has a first nitrogen concentration, and the second portion has a second nitrogen concentration substantially less than the first nitrogen concentration.


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