The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jan. 16, 2024
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jin Kwan Park, Suwon-si, KR;

Daehyun Kwon, Suwon-si, KR;

Jang Hoo Kim, Suwon-si, KR;

Chang-Hyun Bae, Suwon-si, KR;

Yoo-Chang Sung, Suwon-si, KR;

Hye-Seung Yu, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); H03K 19/00 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1048 (2013.01); H03K 19/0005 (2013.01);
Abstract

A memory module includes a plurality of memory devices. Each of the plurality of memory devices includes a plurality of data input/output pads, a plurality of on-die termination (ODT) circuits each including one or more resistors, a plurality of transceiver circuits each including one or more transmission drivers and one or more reception buffers, and a plurality of equalizer circuits each including one or more inductors. Each of the plurality of equalizer circuits is connected to one of the plurality of data input/output pads, one of the plurality of ODT circuits, and one of the plurality of transceiver circuits. Each of the one or more transmission drivers drives a node of one of the plurality of data input/output pads. Inductances of the one or more inductors have individual values which are based on a driver strength of each of the one or more transmission drivers.


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