The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Apr. 27, 2023
Applicant:
Advantest Corporation, Tokyo, JP;
Inventor:
Peter Weixiang Zheng, San Jose, CA (US);
Assignee:
Advantest Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/44 (2006.01); G01R 31/28 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G01R 1/44 (2013.01); G01R 31/2834 (2013.01); H05K 7/20309 (2013.01); H05K 7/20327 (2013.01);
Abstract
Embodiments disclosed herein provide cooling for a test array (e.g., a semiconductor test array) using a 2-phase refrigerant. Testing can be performed without any added insulation, which improves test site density significantly. The refrigerant can be provided by any suitable refrigerant source, such as a pump or valve-controlled pressure chamber, for example, and can be provided to a cold plate of a test site, for example. The cold plate can include a flow field or flow channels for guiding the refrigerant to evenly cool surfaces and/or prevent condensation forming on outer surfaces of the cold plate or test site.