The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jun. 14, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seungmin Ryu, Hwaseong-si, KR;
Younsoo Kim, Yongin-si, KR;
Gyuhee Park, Hwaseong-si, KR;
Younjoung Cho, Hwaseong-si, KR;
Yutaro Aoki, Tokyo, JP;
Wakana Fuse, Tokyo, JP;
Kazuki Harano, Tokyo, JP;
Takanori Koide, Tokyo, JP;
Yoshiki Manabe, Tokyo, JP;
Kazuya Saito, Tokyo, JP;
Hiroyuki Uchiuzou, Tokyo, JP;
Assignees:
SAMSUNG ELECTRONICS CO., LTD.;
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07F 9/00 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); H10K 71/16 (2023.01); H10K 85/30 (2023.01);
U.S. Cl.
CPC ...
C07F 9/005 (2013.01); C23C 16/34 (2013.01); C23C 16/45536 (2013.01); C23C 16/45557 (2013.01); H10K 71/166 (2023.02); H10K 85/30 (2023.02);
Abstract
An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),