The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Aug. 31, 2020
Fuzhou University, Fujian, CN;
Mindu Innovation Lab, Fujian, CN;
Xiongtu Zhou, Minhou County, CN;
Guixiong Chen, Fujian, CN;
Tailiangi Guo, Fujian, CN;
Yongai Zhang, Fujian, CN;
Chaoxing Wu, Fujian, CN;
Zhixian Lin, Fujian, CN;
Qun Yan, Fujian, CN;
FUZHOU UNIVERSITY:MINDU INNOVATION LAB, Fujian, CN;
Abstract
A non-direct electrical contact orientation ordered nLED light-emitting display device comprises an upper drive electrode substrate, an upper drive electrode, an nLED grain sheet, a lower drive electrode and a lower drive electrode substrate that are sequentially arranged from top to bottom, and is further provided with an AC drive control module having two ends connected to the upper drive electrode and the lower drive electrode respectively. The nLED grain sheet is formed by a plurality of nLED grains that are arranged in order, so when the nLED grain sheet is disposed between the electrode substrates, a light-emitting layer of each nLED grain is parallel to the electrode substrates and perpendicular to the electric field. At least one of the upper drive electrode and the lower drive electrode is isolated from the nLED grains by an insulating dielectric layer. In presence of the AC drive signal, the nLED grains are lighted up through electromagnetic coupling. The invention adopts a non-direct electrical contact method to realize ordered nLED light-emitting display, thus omitting the transfer of a greater number of μLEDs and nLEDs and effectively reducing the process cost.