The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Jun. 24, 2022
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Alexander Komposch, Morgan Hill, CA (US);
Eng Wah Woo, Ipoh, MY;
Soon Lee Liew, Ipoh, MY;
Kok Meng Kam, Ipoh, MY;
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/24 (2006.01); H01L 23/36 (2006.01); H01L 23/66 (2006.01); H03F 1/52 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H03F 3/245 (2013.01); H01L 23/36 (2013.01); H01L 23/66 (2013.01); H03F 1/523 (2013.01); H03F 3/195 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01);
Abstract
A semiconductor device package includes an interconnect structure with a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device. A protective structure on the first surface of the interconnect structure exposes a heat dissipating surface facing away from the interconnect structure in one or more directions. Related devices and fabrication methods are also discussed.