The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Mar. 15, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Ying-Jui Huang, Hsinchu County, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chien-Ling Hwang, Hsinchu, TW;
Chia-Sheng Huang, Hsinchu County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H10D 84/01 (2025.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/187 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/67265 (2013.01); H01L 21/681 (2013.01); H01L 21/682 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H10D 84/01 (2025.01); H01L 2224/7565 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01);
Abstract
A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support and comprising a fiducial pattern, and a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component.