The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Jun. 20, 2023
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Chin-Sheng Wang, Taoyuan, TW;

Ra-Min Tain, Hsinchu County, TW;

Chih-Kai Chan, Taoyuan, TW;

Jun-Ho Chen, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/66 (2013.01); H05K 1/0216 (2013.01); H05K 1/189 (2013.01); H05K 3/4691 (2013.01); H05K 3/4697 (2013.01); H01L 2223/6677 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.


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