The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Oct. 25, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Joseph Aubuchon, San Jose, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Michael Rice, Pleasanton, CA (US);

Arkaprava Dan, San Jose, CA (US);

Hanhong Chen, Milpitas, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68764 (2013.01); C23C 16/45544 (2013.01); C23C 16/45551 (2013.01); C23C 16/4584 (2013.01); C23C 16/4588 (2013.01); H01L 21/02104 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/28506 (2013.01);
Abstract

Apparatus and methods to process one or more wafers are described. A spatial deposition tool comprises a plurality of substrate support surfaces on a substrate support assembly and a plurality of spatially separated and isolated processing stations. The spatially separated isolated processing stations have independently controlled temperature, processing gas types, and gas flows. In some embodiments, the processing gases on one or multiple processing stations are activated using plasma sources. The operation of the spatial tool comprises rotating the substrate assembly in a first direction, and rotating the substrate assembly in a second direction, and repeating the rotations in the first direction and the second direction until a predetermined thickness is deposited on the substrate surface(s).


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