The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Jun. 24, 2021
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Kazuma Matsui, Tokyo, JP;

Yuki Oka, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); C09K 13/00 (2006.01); C23F 1/12 (2006.01); G03F 7/36 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/467 (2006.01); H10F 71/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); C09K 13/00 (2013.01); C23F 1/12 (2013.01); G03F 7/36 (2013.01); H01J 37/32422 (2013.01); H01L 21/3065 (2013.01); H01L 21/467 (2013.01); H10F 71/1385 (2025.01); H01J 2237/3346 (2013.01);
Abstract

A plasma etching method capable of selectively etching an etching object containing oxide of at least one of tin and indium compared to a non-etching object. The plasma etching method includes: an etching step of bringing an etching gas containing an unsaturated compound having a fluorine atom and a bromine atom in the molecule thereof into contact with a member to be etched including an etching object to be etched by the etching gas and a non-etching object not to be etched by the etching gas in the presence of plasma, performing etching while applying a bias power exceeding 0 W to a lower electrode supporting the member to be etched, and selectively etching the etching object compared to the non-etching object. The etching object contains oxide of at least one of tin and indium and the non-etching object contains at least one of a silicon-containing compound and a photoresist.


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