The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Jan. 28, 2022
Tokyo Electron Limited, Tokyo, JP;
Masahide Tadokoro, Kumamoto, JP;
Toyohisa Tsuruda, Kumamoto, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A film thickness analysis method includes: acquiring film thickness values at a plurality of measurement points different from each other along a radial direction for a target film formed on an analysis target substrate by supplying a processing liquid while rotating the target substrate based on predetermined liquid processing conditions; and creating an approximate expression related to a film thickness distribution of the target film by approximating the film thickness values at the plurality of measurement points with respect to one Zernike polynomial. The approximate expression is created by specifying a coefficient related to the film thickness of the entire target substrate and one or more coefficients related to concentric curvature components, among a plurality of coefficients included in the Zernike polynomial.