The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Apr. 10, 2024
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Feng-Cheng Yang, Zhudong Township, TW;
Meng-Han Lin, Hsinchu, TW;
Han-Jong Chia, Hsinchu, TW;
Sheng-Chen Wang, Hsinchu, TW;
Chung-Te Lin, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 51/20 (2023.01); G11C 5/06 (2006.01); G11C 11/22 (2006.01); H10D 30/01 (2025.01); H10D 30/69 (2025.01); H10D 84/03 (2025.01); H10D 88/00 (2025.01);
U.S. Cl.
CPC ...
H10B 51/20 (2023.02); G11C 5/06 (2013.01); G11C 11/223 (2013.01); H10D 30/0415 (2025.01); H10D 30/701 (2025.01); H10D 84/038 (2025.01); H10D 88/01 (2025.01);
Abstract
A semiconductor device and method of manufacture are provided. In embodiments a memory array is formed by manufacturing portions of a word line during different and separate processes, thereby allowing the portions formed first to act as a structural support during later processes that would otherwise cause undesired damage to the structures.