The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Oct. 04, 2022
Applicant:
Sumitomo Electric Device Innovations, Inc., Yokohama, JP;
Inventor:
Akira Sahashi, Yokohama, JP;
Assignee:
Sumitomo Electric Device Innovations, Inc., Yokohama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/07 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49565 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 23/552 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/30111 (2013.01);
Abstract
A semiconductor device includes: a package having a top surface and a bottom surface; a semiconductor element arranged in the package; and a base which is arranged in the package and on which the semiconductor element is mounted. A top surface of the base is exposed to the top surface of the package, and a bottom surface of the base is exposed to the bottom surface of the package.