The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Jun. 25, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Meer Nazmus Sakib, Berkeley, CA (US);

Saeed Fathololoumi, Los Gatos, CA (US);

Harel Frish, Albuquerque, NM (US);

John Heck, Berkeley, CA (US);

Eddie Bononcini, Corrales, NM (US);

Reece Defrees, Rio Rancho, NM (US);

Stanley J. Dobek, Rio Rancho, NM (US);

Aliasghar Eftekhar, Fremont, CA (US);

Walter Garay, Plano, TX (US);

Lingtao Liu, Chandler, AZ (US);

Wei Qian, Walnut, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 6/132 (2006.01); G02B 6/136 (2006.01);
U.S. Cl.
CPC ...
G02F 1/0147 (2013.01); G02B 6/132 (2013.01); G02B 6/136 (2013.01);
Abstract

A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.


Find Patent Forward Citations

Loading…