The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Apr. 15, 2024
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Sanghyun Jo, Seoul, KR;
Jinseong Heo, Suwon-si, KR;
Hyangsook Lee, Suwon-si, KR;
Sangwook Kim, Osan-si, KR;
Yunseong Lee, Osan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/68 (2025.01); H01L 21/02 (2006.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 64/691 (2025.01); H01L 21/02181 (2013.01); H01L 21/02194 (2013.01); H01L 21/022 (2013.01); H01L 21/02356 (2013.01); H10D 1/68 (2025.01); H10D 64/689 (2025.01); H10D 64/685 (2025.01);
Abstract
Disclosed herein is a thin film structure, including a first conductive layer on a dielectric layer including a plurality of layers. Each of the plurality of layers includes a dopant layer containing a dopant A and a HfOlayer to form a compound of HfAO(0<x<1, z is a real number). An uppermost layer of the plurality of layers is thickest among the plurality of layers. The first conductive layer contacts the uppermost layer.