Gan-based device based on patterned ohmic contact and manufacturing method thereof

Abstract

A GaN-based device based on patterned ohmic contact is provided, including: a substrate layer, a nucleation layer, a buffer layer, a channel layer, an insertion layer, a barrier layer and a cap layer sequentially disposed in that order from bottom to top. Two ends of the cap layer respectively define ohmic contact recesses extending into the channel layer. A side wall of each ohmic contact recess close to the gate electrode includes multiple arc-shaped side walls and multiple flat side walls. Two epitaxial layers are disposed in the ohmic contact recesses respectively. A passivation layer is covered on the cap layer and the two epitaxial layers, a source electrode and a drain electrode penetrate through the passivation layer and are disposed on the two epitaxial layers respectively. A gate electrode is located between the ohmic contact recesses, and penetrates through the passivation layer and extends to the cap layer.