The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Oct. 15, 2021
Applicant:

Yangtze Memory Technologies Co., Ltd., Hubei, CN;

Inventors:

Yihuan Wang, Wuhan, CN;

Mingkang Zhang, Wuhan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 41/40 (2023.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/40 (2023.02); H01L 2224/0362 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/08146 (2013.01); H01L 2225/06544 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01);
Abstract

Aspects of the disclosure provide a semiconductor device and a method to fabricate the semiconductor device. The semiconductor device includes a first die comprising a first contact structure formed on a face side of the first die. The semiconductor device includes a first semiconductor structure and a first pad structure that are disposed on a back side of the first die. The first semiconductor structure is conductively connected with the first contact structure from the back side of the first die and the first pad structure is conductively coupled with the first semiconductor structure. An end of the first contact structure protrudes into the first semiconductor structure without connecting to the first pad structure. The first die and a second die can be bonded face-to-face.


Find Patent Forward Citations

Wang, Yihuan. (2025). Pad structures for semiconductor devices (U.S. Patent No. 12456698). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12456698

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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