The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Aug. 09, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Hsi-Cheng Hsu, Taichung, TW;
Chen-Wei Chiang, Hsinchu, TW;
Jui-Chun Weng, Taipei, TW;
Hsin-Yu Chen, Hsinchu, TW;
Chia Yu Lin, Taoyuan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu, TW;
Abstract
In some embodiments, a semiconductor device is provided. The semiconductor device includes a semiconductor layer, a micro-electromechanical systems (MEMS) structure defined in the semiconductor layer, a bond ring over the semiconductor layer, and a cap structure over the MEMS structure and bonded to the bond ring. The MEMS structure has an upper surface and the cap structure has a lower surface facing the upper surface of the MEMS structure. Dimples of eutectic material are on the upper surface of the MEMS structure.