The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jun. 16, 2020
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventor:
Tomohiro Nagoya, Tokyo, JP;
Assignee:
RESONAC CORPORATION, TOKYO, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 7/25 (2018.01); C09J 7/30 (2018.01); C09J 179/08 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); C09J 7/25 (2018.01); C09J 7/30 (2018.01); C09J 179/08 (2013.01); H01L 21/6836 (2013.01); H01L 23/3107 (2013.01); H01L 23/495 (2013.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01);
Abstract
A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 μm or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 μm or more.