The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jul. 07, 2022
SK Enpulse Co., Ltd., Pyeongtaek-si, KR;
SK Hynix Inc., Icheon-si, KR;
Seung Chul Hong, Seoul, KR;
Deok Su Han, Seoul, KR;
Jin Hyuk Lim, Icheon-si, KR;
Donghyun Kim, Icheon-si, KR;
Jieun Lee, Icheon-si, KR;
SK enpulse Co., Ltd., Pyeongtaek-si, KR;
SK HYNIX INC., Icheon-si, KR;
Abstract
Embodiments provide a polishing composition for a semiconductor process facilitating the formation of a microcircuit pattern and minimizing the generation of defects and scratches and a method of preparing a polished article using the same. Embodiments provide a polishing composition for a semiconductor process, in which the absorbance ratio of a group having a specific size of particle diameter compared to the overall average particle size (D) is a predetermined ratio or less with respect to the absorbance of a group having a particle diameter more than 0.5 times and 2.5 times or less the overall average particle size.