The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Oct. 23, 2019
Applicant:
Fujimi Incorporated, Kiyosu, JP;
Inventors:
Junya Yamada, Kiyosu, JP;
Hiroyuki Ibe, Kiyosu, JP;
Nobuaki Kato, Kiyosu, JP;
Yuta Kato, Kiyosu, JP;
Yoshikazu Sugiyama, Kiyosu, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/12 (2022.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B22F 1/10 (2022.01); B22F 1/148 (2022.01);
U.S. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/12 (2022.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B22F 1/10 (2022.01); B22F 1/148 (2022.01); B22F 2304/10 (2013.01);
Abstract
There is provided a powder material that is for manufacturing a molded article having low porosity and having uniformly present micropores by an additive layer manufacturing method. A powder material for use in additive layer manufacturing contains ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 30% or more and less than 40%.