The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Dec. 14, 2021
Applicant:

Tokyo Seimitsu Co., Ltd., Hachioji, JP;

Inventor:

Junichi Fukushima, Hachioji, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/32 (2024.01); B08B 1/14 (2024.01); B08B 1/36 (2024.01); B08B 3/02 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B08B 1/14 (2024.01); B08B 1/143 (2024.01); B08B 1/36 (2024.01); B08B 3/02 (2013.01); B08B 1/32 (2024.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01);
Abstract

A wafer back surface cleaning device preventing foreign matter from re-adhering to a wafer during and after cleaning. A hand Hreceives a wafer that has been cleaned at a cleaning position and conveys the wafer to a subsequent process, a hand Hconveys the wafer before grinding to the cleaning position and transfers the wafer that has been cleaned to hand Hwith a front surface of the wafer directed upward. A cleaning pad and a cleaning water supply nozzle discharges the cleaning water to a back surface of the wafer, at the cleaning position, the hand Hbrings the back surface of the wafer to the cleaning position into contact with the cleaning pad to scrub, and receives the cleaning water on the back surface of the wafer after scrub cleaning to perform rinse cleaning, and then transfers the wafer to the hand H


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