The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Feb. 18, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Han Lin, Hsinchu, TW;

Feng-Cheng Yang, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 51/10 (2023.01); G11C 16/04 (2006.01); H01L 23/528 (2006.01); H10B 51/20 (2023.01); H10B 51/50 (2023.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01);
U.S. Cl.
CPC ...
H10B 51/20 (2023.02); G11C 16/0483 (2013.01); H01L 23/5283 (2013.01); H10B 51/10 (2023.02); H10B 51/50 (2023.02); H10D 84/0149 (2025.01); H10D 84/038 (2025.01);
Abstract

A 3D memory array includes a tableland feature formed with multiple 3D memory sub-arrays that are arranged in an X-axis direction. Each 3D memory sub-array includes multiple memory cells that are distributed in multiple columns arranged in the X-axis direction, multiple bit lines extending in a Z-axis direction, multiple source lines extending in the Z-axis direction, and multiple word lines extending in a Y-axis direction. Each memory cell includes a first electrode, a second electrode and a gate electrode. Each bit line interconnects the first electrodes of some of the memory cells aligned in the Z-axis direction. Each bit line is electrically connected to another bit line of the same 3D memory sub-array, which is aligned with the bit line in the X-axis direction, and is electrically isolated from the bit lines of another 3D memory sub-array.


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