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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12444694 B1

PDFFull Text
Date of Patent:
Oct. 14, 2025

Filed:

Jan. 05, 2022

Semiconductor device and method of forming selective emi shielding with slotted substrate

Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

Jinhee Jung, Incheon, KR;

Changoh Kim, Incheon, KR;

Jiwon Lee, Seoul, KR;

Yujeong Jang, Incheon, KR;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:

Brian M. Kaufman

Robert D. Atkins

PATENT LAW GROUP: Atkins and Associates, P.C.

Primary Examiner:

Brent A Fairbanks

Assistant Examiner:

Daniel J Hibbert

Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/26 (2006.01); H01L 21/50 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/12 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01);
Abstract

A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.

Find Patent Forward Citations

Jung, Jinhee. (2025). Semiconductor device and method of forming selective emi shielding with slotted substrate (U.S. Patent No. 12444694). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12444694

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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