The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Jan. 05, 2022
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Jinhee Jung, Incheon, KR;
Changoh Kim, Incheon, KR;
Jiwon Lee, Seoul, KR;
Yujeong Jang, Incheon, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/26 (2006.01); H01L 21/50 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/12 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01);
Abstract
A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.