The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Aug. 30, 2022
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventor:
Qingyuan Tang, Nijmegen, NL;
Assignee:
Nexperia B.V., Nijmegen, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/182 (2013.01);
Abstract
An electronic package having a miniaturized footprint and a method for manufacturing the same is provided. Due to the arrangement of bottom contacts of the electronic package using a first partial vias, a footprint is obtained that is miniaturized with respect to the known electronic package comprising a same-sized electronic component. The electronic package according to the present disclosure enables packaging multiple electronic components while nevertheless minimally increasing the footprint with respect to conventional electronic packages.