The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jul. 27, 2021
Applicant:

V Technology Co., Ltd., Yokohama, JP;

Inventors:

Michinobu Mizumura, Yokohama, JP;

Toshinari Arai, Yokohama, JP;

Takanori Matsumoto, Yokohama, JP;

Takuro Takeshita, Yokohama, JP;

Assignee:

V TECHNOLOGY CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/18 (2006.01); H01J 37/32 (2006.01); H01J 37/317 (2006.01);
U.S. Cl.
CPC ...
H01J 37/18 (2013.01); H01J 37/32449 (2013.01); H01J 37/3174 (2013.01);
Abstract

A focused charged particle beam apparatus which includes a support which supports a substrate to be processed and a focused charged particle beam column equipped with a differential pumping device movable to a location facing a given area of a process target surface of the substrate. The support bears only a periphery of the substrate while keeping the substrate horizontal. A positive pressure chamber is disposed below the substrate borne by the support and works to exert a positive pressure on the whole of the process target area of the substrate to cancel deflection of the substrate arising from its own weight. A local depressurizing mechanism is arranged in the positive pressure chamber and placed out of contact with the substrate. The local depressurizing mechanism works to exert a negative pressure on a lower surface of the substrate to cancel a suction force created by the differential pumping device. The local depressurizing mechanism is movable relative to the substrate following movement of the differential pumping device while facing the differential pumping device through the substrate.


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