The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

May. 01, 2024
Applicant:

Unity Semiconductor, Montbonnot-Saint-Martin, FR;

Inventors:

Wolfgang Alexander Iff, Domène, FR;

Alain Courteville, Congenies, FR;

Assignee:

UNITY SEMICONDUCTOR, Montbonnot-Saint-Martin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/88 (2006.01); B81C 99/00 (2010.01); G01B 11/22 (2006.01); G06T 7/00 (2017.01); G06T 7/521 (2017.01); G06T 7/60 (2017.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); B81C 99/003 (2013.01); G01B 11/22 (2013.01); G06T 7/521 (2017.01); G06T 7/60 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A method for characterizing structures etched in a substrate, such as a wafer is disclosed. A bottom of the structure is embedded in the substrate, the substrate having a top side in which the structures are etched and a bottom side opposite to the top side. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.


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