The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Sep. 22, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Mohamed A Abdelmoneum, Portland, OR (US);

Eduardo Alban, Hillsboro, OR (US);

Whitney Bryks, Chandler, AZ (US);

Brent R. Carlton, Portland, OR (US);

Tarek A. Ibrahim, Mesa, AZ (US);

Nasser A. Kurd, Portland, OR (US);

Jason Mix, Portland, OR (US);

Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);

Sarah Shahraini, Santa Clara, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); B81B 3/00 (2006.01); H03H 9/02 (2006.01); H10N 30/09 (2023.01); H10N 30/20 (2023.01); H10N 30/853 (2023.01);
U.S. Cl.
CPC ...
H10N 30/853 (2023.02); B81B 3/0018 (2013.01); H03H 9/02244 (2013.01); H10N 30/09 (2023.02); H10N 30/20 (2023.02); B81B 2201/0271 (2013.01);
Abstract

An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.


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