The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Dec. 18, 2020
Ams-osram Ag, Premstaetten, AT;
Ching-Lun Lee, Eindhoven, NL;
ams-OSRAM AG, Premstaetten, AT;
Abstract
A method of forming a sandwich passivation layer () on a semiconductor device () comprising a bond pad () is provided. The method comprises forming a first layer () over a surface of the semiconductor device (), removing a part of the first layer () to expose a surface of the bond pad (), forming a second layer () over the first layer () and the surface of the bond pad (), and forming a third layer () over the second layer (), wherein the surface of the bond pad () is not in contact with the first layer () or third layer ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile