The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Aug. 30, 2023
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Peter A Dvorak, Menlo Park, CA (US);

Eric W Bates, San Jose, CA (US);

Ana Papio Toda, San Jose, CA (US);

Yiren Wang, Cupertino, CA (US);

Hao Xu, Cupertino, CA (US);

Yuan Tao, Santa Clara, CA (US);

Han Wang, Campbell, CA (US);

Jack R Lanzi, San Francisco, CA (US);

Ronald Lam, Berkeley, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 1/028 (2013.01); H05K 1/181 (2013.01); H05K 5/0217 (2013.01); H05K 7/1427 (2013.01); H04R 1/02 (2013.01); H04R 2499/11 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01);
Abstract

An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.


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