The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jun. 07, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Chan-Hong Chern, Palo Alto, CA (US);
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H10F 77/40 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H10F 77/413 (2025.01); H01L 2224/08145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48225 (2013.01);
Abstract
A semiconductor package includes a photonic die having a first side and a second side opposite to each other. The semiconductor package includes an electrical die having a third side and a fourth side opposite to each other. The first side of the photonic die faces the third side of the electrical die. The photonic die has an index matching material extending from a surface of the photonic die on the second side into the photonic die.