The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Sep. 28, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Sagar Suthram, Portland, OR (US);
Seung-June Choi, Portland, OR (US);
Vishal Javvaji, Hillsboro, OR (US);
Soumya Kar, Hillsboro, OR (US);
Ahmed Esmail, Hillsboro, OR (US);
Gokul Malyavanatham, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/66 (2006.01); H10D 1/47 (2025.01); H10D 86/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5228 (2013.01); H01L 23/5226 (2013.01); H01L 23/66 (2013.01); H10D 1/47 (2025.01); H10D 86/85 (2025.01); H01L 2223/6672 (2013.01);
Abstract
A semiconductor structure is disclosed. The semiconductor structure includes back end layers that include a first metallization layer, a second metallization layer, and a scalable resistor between the first metallization layer and the second metallization layer. The semiconductor structure also includes front end layers.