The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Apr. 05, 2024
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Devon Michael Diehl, Durham, NC (US);
Joshua Venton Negley, Hillsborough, NC (US);
Assignee:
WOLFSPEED, INC., Durham, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/40 (2014.01); H01L 21/02 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/40 (2013.01); B23K 26/032 (2013.01); B23K 26/0869 (2013.01); H01L 21/02013 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract
Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes removing a wide bandgap semiconductor wafer from a boule using a removal process. The method includes ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material (e.g., by about 25 microns or greater).