The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Jul. 21, 2023
Applicant:
United Microelectronics Corp., Hsinchu, TW;
Inventor:
Zhi-Biao Zhou, Singapore, SG;
Assignee:
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/05 (2023.01); H10N 30/072 (2023.01);
U.S. Cl.
CPC ...
H10N 30/05 (2023.02); H10N 30/072 (2023.02);
Abstract
A method for manufacturing a semiconductor module is provided. The method includes: providing a substrate, wherein the substrate comprises a front side and at least one semiconductor element formed on the front side; forming a shielding structure on the at least one semiconductor element; forming a piezoelectric layer on the shielding structure.
Zhou, Zhi-Biao. (2025). Method for manufacturing semiconductor module including piezoelectric layer (U.S. Patent No. 12433165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12433165
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile