The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Nov. 30, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Shinichiro Miyahara, Kariya, JP;

Shunsuke Harada, Kariya, JP;

Tomoo Morino, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H01L 21/04 (2006.01); H10D 12/01 (2025.01); H10D 30/66 (2025.01); H10D 62/17 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 62/109 (2025.01); H01L 21/0465 (2013.01); H01L 21/049 (2013.01); H10D 12/031 (2025.01); H10D 30/665 (2025.01); H10D 30/668 (2025.01); H10D 62/107 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01);
Abstract

A semiconductor device includes a vertical semiconductor element having a deep layer, a current dispersion layer, a base region, a high-concentration region, and a trench gate structure. The deep layer has multiple sections being apart to each other in one direction. The current dispersion layer is between adjacent two of the sections of the deep layer. The high-concentration region is on a portion of the base region. The trench gate structure includes a gate trench, a gate insulation film and a gate electrode. The current dispersion layer is at a bottom of the trench gate structure, and has an ion-implanted layer extending from a bottom portion of the gate trench to a bottom portion of the deep layer or a location below the bottom portion of the deep layer.


Find Patent Forward Citations

Loading…