The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Jul. 14, 2023
Applicant:
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Inventor:
Cyprian Emeka Uzoh, San Jose, CA (US);
Assignee:
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67132 (2013.01); H01L 21/67253 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 21/78 (2013.01); H01L 23/48 (2013.01); H01L 24/97 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01L 21/67144 (2013.01); H01L 24/81 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80012 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80019 (2013.01); H01L 2224/80031 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/97 (2013.01);
Abstract
Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film or surface. Systems include integrated cleaning components arranged to perform multiple cleaning processes simultaneously.