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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12431448 B1

PDFFull Text
Date of Patent:
Sep. 30, 2025

Filed:

Aug. 17, 2022

Semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Tohru Shirakawa, Matsumoto, JP;

Yasunori Agata, Matsumoto, JP;

Naoki Saegusa, Matsumoto, JP;

Kaname Mitsuzuka, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Jung Kim

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H10D 64/23 (2025.01); H01L 23/29 (2006.01); H10D 12/00 (2025.01); H10D 62/83 (2025.01); H10D 64/62 (2025.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 22/32 (2013.01); H01L 24/06 (2013.01); H10D 64/231 (2025.01); H01L 23/296 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05019 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/0615 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/186 (2013.01); H10D 12/481 (2025.01); H10D 62/83 (2025.01); H10D 64/62 (2025.01);
Abstract

A semiconductor device including a semiconductor substrate, the semiconductor device including: a sensing portion that is provided on the semiconductor substrate and that is configured to detect predetermined physical information; a sensing pad portion that is provided above an upper surface of the semiconductor substrate and that is connected to the sensing portion; a gate runner which is provided above the upper surface of the semiconductor substrate and to which a gate potential is applied; and one or more separated conductive portions in which each separated conductive portion is provided between the sensing pad portion and the semiconductor substrate and that is separated from the gate runner.

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