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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12431434 B1

PDFFull Text
Date of Patent:
Sep. 30, 2025

Filed:

Feb. 17, 2022

Built-in component board, method of manufacturing the built-in component board

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Takashi Kasuga, Nagano, JP;

Takashi Sato, Nagano, JP;

Yasuyuki Yamaguchi, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Christine A Enad

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/486 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/53204 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01);
Abstract

A built-in component board includes a first insulating layer; wiring layer and a metal pad layer that are formed on the first insulating layer; a second insulating layer that is formed on the wiring layer and the metal pad layer; and a cavity that is formed on the second insulating layer and that exposes the metal pad layer. Furthermore, the built-in component board includes an electronic component that is mounted on the metal pad layer; and a filling layer that is filled in the cavity and that buries the electronic component. Furthermore, a metal used for the metal pad layer includes a metal having thermal conductivity that is lower than that of a metal used for the wiring layer.

Find Patent Forward Citations

Kasuga, Takashi. (2025). Built-in component board, method of manufacturing the built-in component board (U.S. Patent No. 12431434). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12431434

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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