The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Jul. 20, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Yasutaka Mizomoto, Kumamoto, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/30 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/02334 (2013.01); H01L 21/67092 (2013.01); H01L 21/30 (2013.01);
Abstract
A substrate processing method includes preparing a stacked substrate including a first substrate divided into multiple chips, a protective film divided for each of the multiple chips to protect the chip, a second substrate supporting the first substrate, and an adhesive film configured to attach the protective film and the second substrate; reducing adhesive strength of the adhesive film with a light beam configured to penetrate the second substrate; and picking-up, from the adhesive film by a pick-up device, the chip and the protective film with the reduced adhesive strength to the adhesive film.