The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

May. 16, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Yoshinobu Saito, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/38 (2014.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B23K 26/38 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A processing apparatus includes a reinforcing portion removing mechanism. The reinforcing portion removing mechanism includes a laser beam irradiating unit configured to form a cutting groove by applying a laser beam to a base of a ring-shaped reinforcing portion formed on a periphery of a wafer, a first raising and lowering table configured to hold and raise a frame unit temporarily placed on a temporary placement table, and position the frame unit at the laser beam irradiating unit, and a separating unit configured to separate the ring-shaped reinforcing portion from the cutting groove. The separating unit includes an ultraviolet ray irradiating unit, a second raising and lowering table, a separator, and a discarding unit.


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