The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Mar. 25, 2024
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Christopher G. Wieduwilt, Boise, ID (US);
Lawrence D. Smith, Boise, ID (US);
James S. Rehmeyer, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/22 (2006.01); G11C 7/10 (2006.01); G11C 17/16 (2006.01);
U.S. Cl.
CPC ...
G11C 7/222 (2013.01); G11C 7/106 (2013.01); G11C 7/1063 (2013.01); G11C 7/1087 (2013.01); G11C 7/109 (2013.01); G11C 17/16 (2013.01);
Abstract
Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.