The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Nov. 24, 2022
Applicant:

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, CN;

Inventor:

Yukihiro Nagai, Quanzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H10B 12/312 (2023.02); H01L 23/5283 (2013.01); H10B 12/482 (2023.02); H10B 12/485 (2023.02);
Abstract

The present disclosure provides a semiconductor device and a method of fabricating the same, which includes a substrate, a resistor structure, a bit line structure, and a bit line contact. The substrate has an active area and a plurality of isolating regions. The resistor structure is disposed on the isolating regions, and includes a first semiconductor layer, a first capping layer, a first spacer. The bit line structure is disposed on the substrate to intersect the active area and the isolating regions, and includes a second semiconductor layer, a first conductive layer, a second capping layer, and a second spacer. The bit line contact is disposed in the substrate to partially extend into the second semiconductor layer, wherein the bit line contact and the first semiconductor layer include a same semiconductor material.


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