The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

May. 24, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventor:

Ping-Heng Wu, Hefei, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01L 21/311 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H10B 63/00 (2023.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10B 12/03 (2023.02); H01L 21/31111 (2013.01); H01L 21/4825 (2013.01); H01L 21/76877 (2013.01); H10B 12/09 (2023.02); H10B 63/00 (2023.02); H10D 1/692 (2025.01);
Abstract

A semiconductor device includes: a substrate, and a plurality of conductors. A plurality of conductors are configured to form first electrodes of capacitor structures, and are distributed on one side of the substrate in rows and columns. Each of the conductors comprises a columnar body and a plurality of annular bumps. A part of an axial direction of the columnar body is intersected with the substrate. The annular bumps are arranged around the circumference of the columnar body, and a protruding direction of the annular bumps is parallel to the substrate. The plurality of annular bumps are distributed at intervals in the axial direction of the columnar body. Annular bumps of the conductors adjacent in row and column directions are staggered in a direction perpendicular to the substrate.


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