The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Oct. 28, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Hsiang-Cheng Tsai, Kaohsiung, TW;
Jui-Che Wu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/13 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/13 (2013.01);
Abstract
An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.