The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Sep. 07, 2021
Applicant:
Sumitomo Electric Device Innovations, Inc., Yokohama, JP;
Inventor:
Ayuhiko Saitou, Yokohama, JP;
Assignee:
Sumitomo Electric Device Innovations, Inc., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/16 (2013.01); H01L 23/49838 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/0521 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor device according to one embodiment includes: a semiconductor chip having a transistor and a drain pad provided on a board; a capacitor having an upper electrode and a lower electrode interposing a dielectric; a pad; and an empty pad provided on the board of the semiconductor chip. The semiconductor device further includes: a first wire connecting the pad and the drain pad of the semiconductor chip to each other, a second wire connecting the empty pad and the upper electrode of the capacitor to each other, and a third wire connecting the pad and the empty pad to each other.