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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12424524 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

Oct. 13, 2020

Semiconductor devices and methods of manufacturing semiconductor devices

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Shaun Bowers, Gilbert, AZ (US);

Yoshio Matsuda, Chandler, AZ (US);

Hyung Il Jeon, Gyeonggi-do, KR;

Byong Jin Kim, Seoul, KR;

Gi Jeong Kim, Gyeonggi-do, KR;

Jae Min Bae, Seoul, KR;

Seung Woo Lee, Incheon, KR;

Yong Ho Son, Incheon, KR;

Assignee:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Attorney:

Spectrum IP Law Group LLC

Primary Examiner:

Sue A Purvis

Assistant Examiner:

Aneta B Cieslewicz

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3178 (2013.01); H01L 23/3192 (2013.01); H01L 23/492 (2013.01); H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49582 (2013.01); H01L 23/49811 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 25/105 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 25/0652 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01);
Abstract

In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.

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