The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Mar. 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shahaji B. More, Hsinchu, TW;
Chandrashekhar Prakash Savant, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
Disclosed are methods for manufacturing semiconductor devices that include the operations of forming a first interconnect segment over a semiconductor substrate, forming a cap layer of a first metal over a top surface of the first interconnect segment, and modifying an exposed surface of the cap layer to form an organometallic film by adding ammonia to the top surface of the cap layer, reacting a portion of the ammonia with residual methyl radicals present on the top surface of the cap layer, and removing hydrogen from both the ammonia and the methyl radicals to form an organometallic film on the cap layer.