The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Jul. 28, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Tsun-Kai Tsao, Tainan, TW;

Jiech-Fun Lu, Madou Township, TW;

Shih-Pei Chou, Tainan, TW;

Tzu-Ming Wang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/806 (2025.01); H10F 39/014 (2025.01); H10F 39/024 (2025.01); H10F 39/18 (2025.01); H10F 39/8037 (2025.01); H10F 39/811 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01); H10F 39/807 (2025.01);
Abstract

Various embodiments of the present disclosure are directed towards an integrated chip including an optical device within or on a semiconductor substrate. A light guide structure overlies the optical device. A first etch stop layer extends along first sidewalls and a lower surface of the light guide structure. A second etch stop layer overlies the first etch stop layer and extends along second sidewalls of the light guide structure.


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