The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jul. 25, 2022
Winbond Electronics Corp., Taichung, TW;
Jiun-Sheng Yang, Taichung, TW;
Yi-Chin Chen, Taichung, TW;
WINBOND ELECTRONICS CORP., Taichung, TW;
Abstract
A semiconductor device includes a first insulating layer over a substrate and a contact plug in the first insulating layer and in contact with the surface of the substrate. The semiconductor device further includes a capacitor structure above the contact plug and a second insulating layer on the first insulating layer and covering the capacitor structure. The capacitor structure includes a conductive layer over the first insulating layer. The semiconductor device further includes a capacitor contact over the capacitor structure. The capacitor contact includes a first contact portion and a second contact portion. The first contact portion penetrates through the second insulating layer and is in contact with the conductive layer of the capacitor structure. The second contact portion connects the outer surface of the first contact portion, and surrounds the lower portion of the first contact portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile