The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Oct. 31, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Rajiv Joshi, Yorktown Heights, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01);
Abstract

Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a semiconductor chip having a frontside and a backside; a first metal level at the backside of the semiconductor chip; a second metal level above the first metal level; a plurality of damascene vias extending from the second metal level towards the first metal level; and a plurality of subtractive vias extending from the first metal level towards the second metal level, wherein the plurality of damascene vias and the plurality of subtractive vias are staggered to form an interdigitated comb-comb structure. A method of forming the semiconductor structure is also provided.


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